| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499305 | Scripta Materialia | 2012 | 4 Pages |
Abstract
Titanium has a very large heat of transport value of −768 kJ mol–1. However, thermomigration of Ti in solder joints has not been examined. In this study, void formation was observed in non-current-stressed Al traces during electromigration and thermomigration tests of SnAg solder joints. Voids formed inside the traces located above the solder bumps with no current flow. We found that Ti thermomigration occurred in the joint, resulting in the reaction of Al and Cu, leaving voids behind in the Al trace.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Hsiao-Yun Chen, Han-Wen Lin, Chien-Min Liu, Yuan-Wei Chang, Annie T. Huang, Chih Chen,