Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1499318 | Scripta Materialia | 2012 | 4 Pages |
Abstract
Grain growth during indentation at low temperatures has been taken to imply that grain growth is largely stress induced and athermal in nanometals. Indentation experiments on electrodeposited nano-Ni indicate clearly that the load required for grain growth decreases with an increase in temperature, suggesting strongly that concurrent grain growth is thermally activated.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
M.J.N.V. Prasad, A.H. Chokshi,