| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499329 | Scripta Materialia | 2012 | 4 Pages |
Abstract
The thermal stability of sputtered Co–Cu–Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu50Ag50 and monolithic Cu. After annealing at 973 K, the grain size of Co34Cu33Ag33 was ∼115 nm, whereas that of Cu50Ag50 increased to over 700 nm. The hardness of annealed Co34Cu33Ag33 TPIN remained high, ∼3 GPa, comparing to only 1.0 GPa for Cu50Ag50 film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Y. Chen, Y. Liu, F. Khatkhatay, C. Sun, H. Wang, X. Zhang,