| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499355 | Scripta Materialia | 2012 | 4 Pages |
Abstract
Interfacial reaction under in a confined space is becoming an increasingly important issue, due to its applications for wafer bonding in three-dimensional integrated circuits. This study aims to uncover the space confinement effects on Ni/Sn and Ni/SnAg reactions. Space confinement causes the formation of voids near the center of Ni/Sn/Ni sandwiches. Adding Ag effectively eliminates these voids, which, if present, would undoubtedly degrade the reliability of wafer bonding joints. The mechanism for the formation of these voids is proposed and verified.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
H.Y. Chuang, J.J. Yu, M.S. Kuo, H.M. Tong, C.R. Kao,