Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1499541 | Scripta Materialia | 2012 | 4 Pages |
Abstract
In this study, the in situ tensile creep behaviors of Sn–4Ag/Cu solder joints were observed, and microstructural evolutions of the solder during the deformation processes were characterized by electron backscatter diffraction. The results reveal that slow plastic deformation or grain rotation occurs inside different solder grains, depending on their orientations and distance from the joint interface. When the strain increases to a certain extent, dynamic recovery occurs inside some solder grains, resulting in polygonization and grain subdivision.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Q.K. Zhang, Z.F. Zhang,