Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles

Cu matrix composites reinforced with Ti-coated diamond particles were consolidated by spark plasma sintering. A layered structure of TiC/transition layer was formed uniformly on the diamond particle surface, with a total thickness of ∼285 nm. A high thermal conductivity of 493 W m−1 K−1 was achieved in the Cu/Ti-coated diamond composites. The greatly enhanced thermal conductivity is ascribed to the 285 nm thick Ti coating. Ti coating on diamond particles is therefore an effective way to enhance the thermal conductivity of Cu/diamond composites.