Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1499615 | Scripta Materialia | 2011 | 4 Pages |
Abstract
This letter examines void nucleation and coalescence in Au–Al wire bonds using high-resolution transmission electron microscopy. It is found that void formation is not only attributed to Kirkendall-type migration as conventionally believed, but also due to volumetric shrinkage and intermetallic oxidation. A volumetric shrinkage of a few percent is associated with intermetallic growth and phase transformations. Intermetallic oxidation occurs at the intermetallics/alumina interface and the migration of oxygen towards the intermetallics leads to void growth and thickening of the surrounding oxide walls.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
H. Xu, C. Liu, V.V. Silberschmidt, S.S. Pramana, T.J. White, Z. Chen, V.L. Acoff,