| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499799 | Scripta Materialia | 2012 | 4 Pages |
Abstract
We studied the thermal conduction of thermal interface materials (TIM) using silver nanoparticles (AgNP) and achieved ultra-low thermal resistance. The experimental data show that silver nanoparticles are very good candidates for TIM in power electronics applications in terms of the reduction in thermal resistance. The ultra-low thermal resistance of the AgNP-based TIM originates from the thinness, high thermal conductivity of silver and low temperature sintering properties of AgNP.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Hui Yu, Liangliang Li, Yujun Zhang,