| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1499850 | Scripta Materialia | 2011 | 4 Pages |
Abstract
⺠Apparent microstructure evolution occurs in the nanostructured Cu during the annealing at 423 K. ⺠The microstructure evolution significantly affects the penetration rate of tracer atoms. ⺠Interfacial diffusivities are determined by considering and neglecting the effect of grain growth. ⺠The diffusivity value determined by neglecting the effect of grain growth is â¼10 times lower.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Z.B. Wang, K. Lu, G. Wilde, S.V. Divinski,