Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1500261 | Scripta Materialia | 2011 | 4 Pages |
Abstract
The microstructure of carbon nanotube reinforced copper matrix (CNT/Cu) nanocomposites, processed by molecular-level mixing, exhibits CNTs homogeneously dispersed in the Cu matrix. Measured thermal conductivity of the fabricated CNT/Cu nanocomposites decreased as the CNT volume fraction increased from 5% to 10%. A low coefficient of thermal expansion (CTE) was obtained from the 10 vol.% CNT/Cu nanocomposite. These results indicate that embedded CNTs provide CNT/metal interfaces as thermal barriers but also stiffen the metal matrix composites.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Kyung Tae Kim, Jürgen Eckert, Gang Liu, Jin Man Park, Byung Kyu Lim, Soon Hyung Hong,