Article ID Journal Published Year Pages File Type
1500261 Scripta Materialia 2011 4 Pages PDF
Abstract

The microstructure of carbon nanotube reinforced copper matrix (CNT/Cu) nanocomposites, processed by molecular-level mixing, exhibits CNTs homogeneously dispersed in the Cu matrix. Measured thermal conductivity of the fabricated CNT/Cu nanocomposites decreased as the CNT volume fraction increased from 5% to 10%. A low coefficient of thermal expansion (CTE) was obtained from the 10 vol.% CNT/Cu nanocomposite. These results indicate that embedded CNTs provide CNT/metal interfaces as thermal barriers but also stiffen the metal matrix composites.

Related Topics
Physical Sciences and Engineering Materials Science Ceramics and Composites
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