| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1500541 | Scripta Materialia | 2010 | 4 Pages |
Abstract
This study examined the ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joints using in situ transmission electron microscopy (TEM). TEM confirmed the formation of an Ni2P phase underneath the ternary Ni2SnP after reflowing. We can directly observe the Sn diffused into Ni2P to form Ni2SnP during annealing in TEM. These results suggested that the ternary Ni2SnP forms through the diffusion of Sn into Ni2P. In addition, small Kirkendall voids were newly formed in the ternary Ni2SnP layer after annealing in TEM.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang,