Experimental evidence for liquid/solid interface instability caused by the stress in the solid during directional solidification under a strong magnetic field

The stress in the solid near the liquid/solid interface and its effect on the interface instability in directionally solidified Al–0.85 wt.% Cu alloy and pure Al under a strong (10 T) magnetic field has been investigated experimentally. Observing the liquid/solid interface shape and studying the electron backscatter diffraction of the interface substructure yields experimental evidence for the formation of the stress in the solid near the liquid/solid interface and the liquid/solid interface instability caused by the stress under a strong magnetic field.