| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1500595 | Scripta Materialia | 2009 | 4 Pages |
Abstract
We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformation with a composite microstructure of nanoscale grains and embedded nanoscale twin bundles. The improvement in fracture toughness is mainly due to the embedded twin bundles which generate elongated deep fracture dimples that consume much higher fracture energy.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
E.W. Qin, L. Lu, N.R. Tao, K. Lu,