Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1500714 | Scripta Materialia | 2009 | 4 Pages |
Abstract
The contact angle of liquid Cu on monocrystalline and polycrystalline Co surfaces is found to be close to zero, and some of the grain boundaries of the Co polycrystal are completely wetted by liquid Cu. The consistency of these results is discussed in terms of interfacial, grain boundary and surface energies in the Co–Cu system. The Co solid/Cu liquid interfacial energy is found to be equal to or smaller than 390 mJ m−2 at 1383 K.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Stefano Curiotto, Dominique Chatain,