Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1500885 | Scripta Materialia | 2010 | 4 Pages |
Abstract
Sn–37Pb solder and pure Sn metal exhibit a conspicuous high-temperature damping background (HTDB) in low-frequency internal friction Q-1(T)Q-1(T) curves with activation energies, H, of HTDB being 0.43 and 0.98 eV, respectively. Sn–37Pb solder has a lamellar eutectic structure that can promote the diffusion-assisted climb of dislocations, resulting in lower H . Sn–3Ag–0.5Cu solder shows no HTDB in Q-1(T)Q-1(T) curves since the formation of Cu6Sn5 and Ag3Sn intermetallics in the eutectic network band can impede dislocation motion.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
S.H. Chang, S.K. Wu,