Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1500969 | Scripta Materialia | 2008 | 4 Pages |
Abstract
Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic η′-Cu6Sn5 at temperatures lower than 186 °C to hexagonal η-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn–0.7 wt.% Cu–0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)6Sn5 is ∼9 at.% Ni, the hexagonal allotrope of (Cu, Ni)6Sn5 becomes stable at room temperature.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Kazuhiro Nogita, Tetsuro Nishimura,