| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1501028 | Scripta Materialia | 2010 | 4 Pages |
Abstract
The microstructure formation at the interface in a copper-clad aluminum bimetallic wire has been investigated. Ultra-fine copper grains with sizes of 200 nm are formed near the Cu/Al interface when the wire is drawn after heat treatment. The formation of the ultra-fine copper grains is attributed to low-temperature recrystallization from strain that develops as the copper plastically flows around a broken dispersion of intermetallics at the interface. The ultra-fine copper grains added extra strength to the Cu/Al interface.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
T.T. Sasaki, R.A. Morris, G.B. Thompson, Y. Syarif, D. Fox,