Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1501035 | Scripta Materialia | 2010 | 4 Pages |
Abstract
Creep behavior was investigated carefully for typical face-centered cubic (fcc) metals, i.e., high purity Al, Cu, and Pb, below 0.3Tm, where Tm is the melting temperature. All samples showed marked creep behavior at such low temperatures, with an apparent activation energy of 15–30 kJ mol−1, a stress exponent of 2–5 and a grain size exponent of 0. These results show a new creep region that has not appeared in deformation mechanism maps of pure fcc metals.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Tetsuya Matsunaga, Shouji Ueda, Eiichi Sato,