| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1501137 | Scripta Materialia | 2008 | 4 Pages |
Abstract
The growth mechanisms of Cu3Sn at the interface between eutectic SnBi solder and Cu were investigated by transmission electron microscopy. On (1 0 0) Cu the interfacial reaction during reflow resulted in a columnar growth of Cu3Sn along Cu [1 0 0] with a special crystallographic relationship of (21¯0)Cu3Sn∥(4¯02)Cuand[122]Cu3Sn∥[010]Cu. In the subsequent solid-state aging new triangular Cu3Sn grains nucleated and grew at the triple junction sites of the interface between Cu and two adjacent Cu3Sn grains.
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Authors
P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang,