| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1501631 | Scripta Materialia | 2008 | 4 Pages |
Abstract
Transmission electron microscopy evidence was obtained to elucidate the mechanism for Bi-induced interfacial void formation in solder joints. After thermal aging, Bi segregated to the Cu3Sn/Cu to form fine particles on the interface in SnBi/Cu solder joints. Interfacial voids were found near the interfacial Bi particles.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang,