| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1501735 | Scripta Materialia | 2008 | 4 Pages |
Abstract
We have studied the effects of grain boundary adhesion and grain size on the ductility of thin metal films well bonded to polymer substrates, using a finite element method. It is shown that the ductility of polymer-supported metal films increases approximately linearly as the grain boundary adhesion increases, and as the grain size decreases. A rule-of-thumb estimate of the ductility of polymer-supported metal films agrees well with the simulation results.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Zhao Zhang, Teng Li,