| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1501746 | Scripta Materialia | 2008 | 4 Pages |
Abstract
A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the “supercooled liquid” region while a small normal force is applied to the joint. This results in liquid reflow, wetting and a strong bond. Complete wetting between copper substrates and a layer of platinum-based BMG leads to an atomistically intimate void-free interface.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Jin-Yoo Suh, Boonrat Lohwongwatana, Carol M. Garland, R. Dale Conner, William L. Johnson, Daewoong Suh,