| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1501789 | Scripta Materialia | 2008 | 4 Pages |
Abstract
Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
T. Schubert, Ł. Ciupiński, W. Zieliński, A. Michalski, T. Weißgärber, B. Kieback,