Growth kinetics and size distribution of intermetallic compound grains in soldering reaction based on separate measurements of grain radius and height

A phase-field simulation was employed to estimate the kinetics and size distribution of the intermetallic compound grains in terms of separately measured grain radius and height. The grain height was rather uniform and had a distribution curve with a narrow sharp peak, not following the grain radius distribution only slightly deviated from the flux-driven ripening model. It was also demonstrated that the cross-sectional grain height was smaller and had a broader distribution than the actual grain height.