| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1502017 | Scripta Materialia | 2007 | 4 Pages |
Abstract
Work hardening behaviors of electrodeposited ultrafine-grained Cu with nanoscale growth twins are investigated by means of uniaxial continuous tensile and loading–unloading tests. A high density of nanoscale twins leads to a significant enhancement in flow strength and work hardening rate, while the work hardening coefficient (n) does not show any obvious variation with the twin density. These effects were analyzed in terms of the post-deformation microstructures.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
X.H. Chen, L. Lu,