Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1502042 | Scripta Materialia | 2006 | 6 Pages |
Abstract
The rates of barrier layer thickness losses for Ni, Cu, Pt, Ti, V, Nb, Ta and W metallizations in contact with the molten 52In–48Sn solder at 200 °C have been studied. Despite the expected complexity of the kinetics of dissolution and intermetallic compound growth, we demonstrate simple empirical relationships between the lifetimes of 1 μm thick barrier layers and thermodynamic properties such as their melting point, specific heat and latent heat of fusion.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
J.F. Li, S.H. Mannan, M.P. Clode,