| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1502047 | Scripta Materialia | 2006 | 5 Pages |
Abstract
Stress change tests were conducted on ultrafine-grained Cu in a region where the grain size is smaller than the steady state subgrain size. After stress reduction the normal creep transients were absent, confirming subgrain strengthening in conventional grain-sized materials and a lack of steady state subgrain structure in the ultrafine-grained materials.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
R. Kapoor, Y.J. Li, J.T. Wang, W. Blum,