Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1502137 | Scripta Materialia | 2007 | 4 Pages |
Abstract
The microstructures of copper chips created by plane strain machining at ambient temperature have been analyzed using transmission electron microscopy (TEM) and orientation imaging microscopy (OIM). The strain imposed in the chips was varied by changing the tool rake angle. Characterization of orthogonal faces of the chips showed the microstructure to be essentially uniform through the chip volume, indicative also of uniform deformation.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
S. Swaminathan, T.L. Brown, S. Chandrasekar, T.R. McNelley, W.D. Compton,