Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1502415 | Scripta Materialia | 2006 | 4 Pages |
Abstract
A combined experimental/simulation approach has been used to characterize the underlying deformation mechanisms associated with stress-assisted grain growth in nanocrystalline Al. Strain rate sensitivity experiments on freestanding submicron thin films undergoing stress-assisted grain boundary migration have uncovered rate sensitivities up to two orders of magnitude larger than previously reported for microcrystalline Al. Molecular dynamics simulations have been used to illustrate that these high strain rate sensitivities coincide with those associated with grain boundary processes such as migration, sliding, and dislocation nucleation.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
D.S. Gianola, D.H. Warner, J.F. Molinari, K.J. Hemker,