| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1502616 | Scripta Materialia | 2006 | 4 Pages |
Abstract
Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
S.J. Wang, C.Y. Liu,