| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1502755 | Scripta Materialia | 2008 | 4 Pages |
Abstract
Metallic conductors on polymeric substrates are frequently used for printed circuit boards or flexible displays. Optimization of these devices is mostly associated with the miniaturization of the conductors which changes their electrical and mechanical properties. We focus on crack formation in gold nano-interconnects about 20 nm high, 40 nm wide and 1 mm long on flexible substrates. The fracture toughness of the gold nanolines is decreased significantly compared to bulk gold.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Sven Olliges, Patric A. Gruber, Steffen Orso, Vaida Auzelyte, Yasin Ekinci, Harun H. Solak, Ralph Spolenak,