| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1502780 | Scripta Materialia | 2006 | 5 Pages |
Abstract
Triple junctions involving twin boundaries in Cu interconnects of integrated circuits have been shown to be potentially detrimental to the manufacturability of the circuit. Microstructures of annealed Cu films are dependent on film thickness and deposition parameters. This work describes texture and twin boundary development in sputtered and annealed Cu films.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
N.-J. Park, D.P. Field,