| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1502933 | Scripta Materialia | 2006 | 6 Pages |
Abstract
In order to improve solder joint life, we have experimented with a lead-free solder reinforced with a NiTi shape memory alloy (SMA). Concept viability was evaluated by conducting thermomechanical double-shear tests on bare SMA wire and single-fiber composites of Sn–3.5Ag matrix reinforced with a single SMA wire. A copper wire reinforced composite served as the control sample. The results indicate that a significant reduction in inelastic strain range can be realized by the SMA composite approach, suggesting a possible payoff in the life of solder joints.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Z.X. Wang, I. Dutta, B.S. Majumdar,