On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X = Cr, B) diamond composites

The evolution of the thermal conductivity and the coefficient of thermal expansion as a function of the alloying content of boron and chromium in the copper matrix in Cu–X/diamond composites is presented. In both systems a transition from weak matrix/diamond bonding to strong bonding is observed, the latter leading concomitantly to high thermal conductivity (>600 W m−1 K−1) and a low coefficient of thermal expansion (<10 ppm K−1).