Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1503403 | Scripta Materialia | 2007 | 4 Pages |
Abstract
Free-standing nanocrystalline Cu films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young’s modulus and yield stress at a 0.2% offset are about 110–130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10−5 s−1. No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Xiaoding Wei, Dongyun Lee, Sanghoon Shim, Xi Chen, Jeffrey W. Kysar,