| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1503488 | Scripta Materialia | 2006 | 4 Pages |
Abstract
A model is proposed for the low temperature tensile response of copper polycrystals with grain sizes in the range of 2–50 μm. The initial work hardening behaviour is strongly grain size dependent and is considered to arise from a combination of kinematic and isotropic hardening due to dislocation–grain boundary interactions. At larger strains, the influence of grain size on work hardening disappears owing to processes associated with dynamic recovery at boundaries.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
C.W. Sinclair, W.J. Poole, Y. Bréchet,