Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1503598 | Scripta Materialia | 2007 | 4 Pages |
Abstract
The internal structure of nanocrystalline Cu near microhardness indentations was examined by electron microscopy. In addition to observing grain growth, the number of low-angle grain boundaries was seen to increase with indenter dwell time and decreasing temperature, suggesting stress-driven grain growth by grain rotation and coalescence. Dislocation structures and deformation twins are described. No impurities could be detected at grain boundaries.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Pratibha L. Gai, Kai Zhang, Julia Weertman,