| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1503644 | Scripta Materialia | 2006 | 5 Pages |
Abstract
A mechanism was proposed to explain the effects of process parameters on bondability in ultrasonic ball bonding. The bondability was determined by the slip area at the bonding interface induced by the evolution of plastic deformation. The occurrence of bonding only at the periphery was attributed to partial slip at the bonding interface.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Jun Qi, Ngar Chun Hung, Ming Li, Deming Liu,