| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1503657 | Scripta Materialia | 2006 | 4 Pages |
Abstract
The electromigration effect on solder bump and interfacial reactions in the Cu/Sn–3Ag–0.5Cu/Cu flip chip joint was investigated at 453 K with 10 kA/cm2. Cu was transported towards the anode and avoid nucleated at the highest current density point near the cathode. The void nucleated at the Sn/Cu6Sn5 interface and grew along the cathode side. It was observed that the unique solder bump deformation towards the cathode started in the early stage of the electromigration test.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma,