Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1503710 | Scripta Materialia | 2006 | 4 Pages |
Abstract
This paper presents a study of the microstructure of a spray formed Si–30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ∼5 μm equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ∼10 μm equiaxed Al-rich grains interpenetrating the Si network with no evidence of a lamellar Al–Si eutectic. This unusual microstructure arose because of the particular solidification conditions during and immediately after the spray forming process and the large alloy freezing range.
Related Topics
Physical Sciences and Engineering
Materials Science
Ceramics and Composites
Authors
S.C. Hogg, A. Lambourne, A. Ogilvy, P.S. Grant,