High Quality Half-cell Processing Using Thermal Laser Separation

Half-cell modules are promising candidates for a new generation of PV-modules as the electrical losses can be reduced while the optical gains are increased. This technological approach requires a cell separation process which does not induce any significant electrical or mechanical damages on cell level. Thermal laser separation (TLS) is a damage free and kerfless dicing technology for brittle materials such as silicon. We investigate the applicability of TLS for the solar cell splitting and compare it to a reference cell-splitting process based on laser scribing and subsequent cleavage. It is found that the electrical properties of the TLS-half-cells are slightly better compared to the reference process and that compared to a laser separation there is no mechanical damage due to the TLS process.