Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition process

Electrodeposition behavior of a Sn–carbon nanotube (CNT) composite was investigated with variations of an electrodeposition time and a current density. Electrodeposition of the Sn–CNT composite could be suggested as repeating processes of Sn layer formation, CNT adsorption, and entrapment of CNTs into the Sn matrix. With increasing the CNT concentration in an electrodeposition solution to 10 g/l, the shear energy of the Sn–CNT composite bumps increased more than 50%, indicating that the mechanical reliability of the solder joints can be substantially improved by using a composite solder reinforced with CNTs.