| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1517627 | Journal of Physics and Chemistry of Solids | 2010 | 5 Pages |
Abstract
A general mesoscopic model for the simulation of thin-film vapor deposition applied to energetic materials, specifically bimetallic multilayers, is presented. We describe the setup of this mesoscopic simulator developed in the frame of a multiscale study by implementing ab initio data into a set of differential equations. We present numerical results relative to the formation of barrier layers as a result of interdiffusion between successive bimetallic AlNi multilayers. The key role of the vacancies species created during deposition is highlighted.
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
A. Hémeryck, M. Petrantoni, A. Estève, C. Rossi, M. Djafari Rouhani, G. Landa, D. Estève,