Preparation of conductive Cu patterns by directly writing using nano-Cu ink

•The synthesis of pure Cu is related to the reducing agent and capping agent.•The sintering under Ar atmosphere prevents Cu pattern's rapid oxidation.•The formation of the bulk Cu decreases the resistivity of the Cu pattern.

Conductive and air-stable Cu patterns were directly made on ordinary photo paper using a roller pen filled with nano-Cu ink, which was mainly composed of metallic Cu nanoparticles (NPs) capped with poly(N-vinylpyrrolidone) (PVP). The nano-Cu NPs were obtained via the reduction of Cu2+ ions by using an excess of hydrazine and PVP. The low sintering temperature (160 °C) in Ar atmosphere played an important role for the preparation of air-stable Cu patterns. The conductivity of a radio-frequency identification antenna made from nano-Cu ink was tested by a lamp, and its resistivity achieved 13.4 ± 0.4 μΩ cm. The Cu NPs were confirmed by means of X-ray powder diffraction and X-ray photoelectron spectra, and the Cu patterns were characterized by scanning electron microscopy and energy dispersive X-ray spectrometry. A mechanism for the high conductivity of the Cu pattern made from Cu NPs is proposed.