| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1522783 | Materials Chemistry and Physics | 2013 | 7 Pages |
Abstract
⺠Cooling method effects on reoxidation process of grain boundaries. ⺠Cu-rich phase spread at grain boundaries enhances the non-ohmic behavior. ⺠Low-temperature polaron relaxation is associated with oxygen vacancies. ⺠Height of the Schottky potential barrier can be modified by cooling rate.
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Authors
Laijun Liu, Danping Shi, Shaoying Zheng, Yanmin Huang, ShuangShuang Wu, Yunhua Li, Liang Fang, Changzheng Hu,