| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1523391 | Materials Chemistry and Physics | 2013 | 5 Pages |
Abstract
⺠Formation of 4 layers after interaction of SAC305 solder with ENIG substrate. ⺠Layers 1-3: NiP-amorphous (corresponding to initial Ni-P coating), Ni12P5, Ni2SnP. ⺠Layer 4: (Ni,Cu)3Sn4 decorated by (Cu,Ni)6Sn5 phase and also small particles of Ag4Sn. ⺠New evidences: Ni12P5 instead of Ni3P, Ni2SnP growth from Ni12P5 not from Ni2P.
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Authors
J. Wojewoda-Budka, Z. Huber, L. Litynska-Dobrzynska, N. Sobczak, P. Zieba,