Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
1525142 | Materials Chemistry and Physics | 2010 | 5 Pages |
Abstract
Ni-Cu alloy nanowire array, with uniform length and diameter, was well fabricated by using alternating current electrodeposition. Both X-ray diffraction and in situ heating extended X-ray absorption fine structure technique were employed to characterize its structural change with temperature. As expected, a weak concentration fluctuation of Ni and Cu atoms was found in the as-prepared nanowires. However, this concentration fluctuation can be easily eliminated by heating the as-prepared sample at 200 °C, which resulting in an approximately homogeneous Ni-Cu solid solution. From the nanostructural point of view, the serviceability temperature of Ni-Cu alloy nanowire array in magnetism could not exceed 200 °C. The Ni-Ni, Ni-Cu and Cu-Cu bonds were found to have different thermal expansion behaviors, causing the distortion of the crystal cell. An average thermal expansion coefficient (1.1 Ã 10â5 Kâ1) was obtained. The structural change of Ni-Cu alloy nanowires with temperature was discussed.
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Authors
Guang Mo, Weidong Cheng, Quan Cai, Wei Wang, Kunhao Zhang, Xueqing Xing, Zhongjun Chen, Zhonghua Wu,