The corrosion inhibition of aluminum and its copper alloys in 1.0 M H2SO4 solution using linear-sodium dodecyl benzene sulfonate as inhibitor

The corrosion inhibition of Al and its two copper alloys are the subject of tremendous technological importance due to the increased industrial applications of these materials. This paper reports the results of potentiodynamic polarization and electrochemical impedance spectroscopic (EIS) measurements on the corrosion inhibition of Al (Al–2.5% Cu and Al–7.0% Cu) alloys in 1.0 M H2SO4 solution carried out in different concentrations of linear-sodium dodecyl benzene sulfonate as an anionic surfactant (LAS) and temperature range from 10 to 60 °C. The data revealed that the inhibition efficiency increases with increasing surfactant concentration and time of immersion, and decreases with solution temperature. Energy dispersion X-ray (EDX) observations of the electrode surface confirmed the existence of LAS adsorbed film on the electrode surface. The surfactant acted mainly as cathodic inhibitor. Maximum inhibition efficiency of the surfactant is observed at concentration around its critical micelle concentration (CMC). The inhibition occurs through adsorption of the surfactant on the metal surface without modifying the mechanism of the corrosion process, which tested by UV-spectroscopy. The potential of zero charge (PZC) of aluminum and Al–7.0% Cu was studied by ac-impedance, and the mechanism of adsorption is discussed. The adsorption isotherm is described by Temkin adsorption isotherm. Thermodynamic functions for activation and adsorption process were determined.