| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 1529150 | Materials Science and Engineering: B | 2012 | 6 Pages |
Abstract
The paper presents a press-pack package integrated with a microchannel cooling system, which is a new thermal solution for power devices, e.g. diodes. In comparison with conventional solutions enforcing the use of either an air cooling system or a liquid one, the novel package is characterised by considerably smaller dimensions, lower weight and significantly higher thermal performance. The conducted measurements of the manufactured model showed that a thermal resistance of 0.0182 K/W can be obtained for an allowable pressure drop for electronic applications.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Electronic, Optical and Magnetic Materials
Authors
Ewa Raj, Zbigniew Lisik, Roman Gozdur, Włodzimierz Fiks,