A promising solution using CVD diamond for efficient cooling of power devices

Diamond has several exceptional physical and chemical characteristics. This is the best material for both electrical insulators (10 MV cm−1) and thermal conductors (2000 W m−1 K−1, five times more than copper at room temperature). In this study, we analyzed and quantified the advantages of the insertion of CVD diamond layer in the innovative thermal management assemblies. We also developed a specific model to simulate the working environment of the component. In the simulation, we compared the use of a traditional substrate (AlN) with that of the diamond CVD one in order to confirm that using the diamond substrate reduced thermal resistance.